Optical filter, production method for this optical filter and optical device using this optical filter and housing structure for this optical filter

ABSTRACT

An optical low pass filter  10  is constituted by a quartz birefringent plate  11 , a quarter wavelength plate  12 , and a quartz birefringent plate  13  layered in that order. Curved chamfered portions  13   a  and  13   b  are formed at a periphery of an outgoing light surface (main surface) of the quartz birefringent plate  13 . The curve chamfering width of a main surface side (t2) is smaller than that of a side surface side (t1).

TECHNICAL FIELD

The present invention relates to optical filters made of one or more optical plates, methods of manufacturing such optical filters, optical devices that use such optical filters, and storage structures for such optical filters.

BACKGROUND ART

Various optical filters such as optical low pass filters are used in image-taking devices such as video cameras and digital still cameras. Such filters perform the role of removing light of unnecessary wavelengths such as infrared light and wave-filtering optical false signals. Using the example of an optical low pass filter, commonly used configurations of such optical filters include configurations in which plates such as a quartz birefringent plate and an infrared cut glass plate are appropriately combined according to the desired wave-filtering characteristics. And in recent years, depending on the application, configurations in which an optical interference film is formed on a single plate are also being used. In the case of a configuration in which a plurality of plates are combined, conventionally the manufacture of such optical filters involved using an adhesive to individually laminate the optical plates to be combined, which were divided into small pieces.

However, in recent years, as shown in JP H9-43542A for example, the so-called multi-cutout manufacturing method has been proposed and implemented, which involves laminating the necessary structural members according to the required wave-filtering characteristics at the stage prior to the cutting of the wafer into small pieces, then performing the cutting to obtain the individual optical filters. Reductions in manufacturing costs have been achieved with manufacturing methods such as this.

On the other hand, the cut edge portions of an optical filter made with the multi-cutout manufacturing method are sharp. These edge portions are often cracked or chipped when viewed microscopically, and there is the possibility that some of the optical plates will suffer from further chipping or cracking. In this case, the cracked pieces or chipped pieces may adhere to the main surface of the optical plate, which is the transmission surface for optical information, and become optical foreign substances. Such foreign substances may be picked up by image-taking elements such as a CCD and become a cause of worsened image quality during video output.

Furthermore, other members may be cut when the edge portions are sharp and such cut pieces can become optical foreign substances. For example, it is common for optical filters to be storage packed in a resin case for delivery to a customer, and edge portions can cut into the inner wall of the resin case due to looseness within with the storage case, thus resulting in cut pieces adhering to the main surface of the optical plate. Configurations have been disclosed with regard to preventing such looseness, such as JP 2000-238877A, in which the side surfaces of the optical filter are fixedly supported, and JP 2001-2167A, in which the optical filter is fixed with an adhesive sheet. However, optical foreign substances also can be produced by contact with the case when the optical filters are taken out from the case to be moved individually.

As a countermeasure against such optical foreign substances, Japanese Utility Model No. 2508176 discloses a configuration in which chamfering that forms a linear slanted surface is performed with respect to the edges formed on the optical filter. Although such a chamfered structure is not sharp, edges are still formed, and these edge portions may be affected by cracking or chipping, thus resulting in pieces being cut from the resin case as mentioned above.

And furthermore, due to the continued miniaturization of image-taking devices such as video cameras, the distance between the front surface of the CCD and the optical filter positioned thereon has been becoming shorter in recent years. And in this case, the optical foreign substances that have adhered to the main surface of the optical filter cause even more conspicuous image defects, leading to worsened image quality during video output.

DISCLOSURE OF INVENTION

The present invention has been devised in light of these technological trends, and it is an object therein to provide a high quality optical filter that can greatly suppress the occurrence of optical foreign substances in optical filters and a method for manufacturing such an optical filter, as well as to provide a storage structure that can maintain the quality of the optical filter.

In order to achieve the above-mentioned object, the present invention forms fewer edges and greatly suppresses the occurrence of optical foreign substances by using curve chamfering for the optical filter, and can therefore solve these issues with the following configurations.

First, an optical filter according to the present invention is provided with one or a plurality of optical plates, wherein curve chamfering is performed on an edge of at least a side surface side of the optical filter. This curve chamfering may be performed on an edge of one main surface side of the optical filter, or may be performed on edges of both main surface sides of the optical filter, it may be performed on a side surface side and one main surface sides or an a side surface side and both main surface sides.

Here, chamfering of an edge of a main surface side refers to chamfering an edge (sides enclosing a main surface) formed on a main surface side. The result of performing this chamfering is that the optical filter is ground across a main surface and a side surface. Furthermore, chamfering of an edge of a side surface refers to chamfering an edge formed between adjoining side surfaces. The result of performing this chamfering is that a side surface of the optical filter is ground.

As curve chamfering is performed on an edge of at least a side surface side of the optical filter, the cracking or chipping of the optical plate that occurs conventionally is greatly suppressed, and the cutting debris that occurs by contact with the case or other portions is also greatly inhibited, and the occurrence of optical foreign substances as a whole is suppressed. Therefore, the adherence of such optical foreign substances to the main surface of the optical filter is eliminated.

Furthermore, in the case of forming curve chamfering on only one main surface, it is easy to chamfer by preparing the form of the dicing blade to cut the wafer into individual small pieces of optical filters after the optical wafer has been laminated to obtain the desired wave-filtering characteristics. It should be noted that, as mentioned above, the shorter the distance between the CCD and an optical foreign substance, the more conspicuous is the image deterioration. Consequently, when performing curve chamfering on only one main surface, it is preferable that the main surface that is curve chamfered so as to have an effect that suppresses the occurrence of optical foreign substances is set on the side of the image-taking element. It should be noted that when curve chamfering is performed on both main surfaces, there is no need to discriminate the placement direction in this way.

Next, in configurations in which curve chamfering is performed on the optical plates that make up an optical filter, it is required that each individual optical plate is chamfered. Such a configuration is the same as the above-mentioned curve chamfering of the optical filter.

That is to say, it is characterized by curve chamfering being performed on an edge of at least a side surface side of each optical plate. This curve chamfering may be performed on an edge of one main surface side of each optical plate, or may be performed on an edge of both main surface sides of each optical plate, or may be performed on an edge of a side surface side and one main surface side of each optical plate, or on a side surface side and both main surface sides of each optical plate.

With these configurations it is also possible to greatly suppress the occurrence of optical foreign substances.

In the above configurations, in the curve chamfering of the edge of the main surface side, an amount of chamfering on a main surface side may be smaller than an amount of chamfering on a side surface side. In the present invention, “chamfering amount” refers to an amount prescribed by a predetermined chamfering width and a curvature by which an amount of a ground optical filter is defined.

With these configurations, it is also possible greatly reduce the occurrence of optical foreign substances since edges are not formed, and by reducing the width of chamfering on the main surface side, the area of actual optical information transmission on the main surface can be kept broad, which greatly contributes to the suppression of image deterioration particularly in regard to recent rapid advances in miniaturization of image-taking devices such as video cameras.

Furthermore, in the curve chamfering of the edges of the main surface side, an amount of chamfering on one main surface side may be smaller than an amount of chamfering on another main surface side.

With this configuration, it is possible to identify the front and back of the optical filter using the differences between the curvatures, not only visually, but also by the sense of touch. It is also possible to carry out this identification using a screen recognition device.

A method for manufacturing an optical filter as described above includes a step of cutting a layered optical wafer, which has been formed as a single optical wafer or a plurality of layered optical wafers that can be cut into a plurality of optical plates, into small pieces using a dicing blade so that divided surfaces of the optical wafer are parallel, and a step of curve chamfering the layered optical wafer using a curved surface blade having a curved surface whose curvature corresponds to a required curve at a position of an edge to be curve chamfered. In this configuration, the order of the step of cutting the wafer and the step of curve chamfering is not a concern, and either may be performed first.

When curve chamfering is formed on both surfaces of the optical filter, it is possible to perform curve chamfering on one surface side with predetermined spacing with a blade having a curved surface portion, to then turn the optical filter over and fix it, and to then form curved portions and perform cutting into small pieces after making the required positional adjustments. The blade used for the cutting into small pieces is a disk-shaped dicing blade for example, and carries out cutting while rotating at high-speed.

Furthermore, as another manufacturing method, after a layered optical wafer is formed, a blade is used that is provided with a dicing blade portion with which the divided surfaces of the optical wafer become parallel to one another, and a curved surface blade portion that has a curved surface corresponding to a curvature of an edge to be curve chamfered, and the layered optical wafer is cut into small pieces with the dicing blade portion, after which curve chamfering is performed with the curved surface blade portion on an edge of the layered optical wafer that has been cut into small pieces.

With this manufacturing method, since the above-described blade is used, it is possible to carry out the processes for cutting into small pieces and curve chamfering for the edges of the optical filter continuously, which is efficient.

In a further manufacturing method, after a layered optical wafer is formed, the layered optical wafer is cut into small pieces using a dicing blade so that divided surfaces of the optical wafer are parallel, and an edge of the layered optical wafer that has been cut into small pieces is curve chamfered by grinding with a grinding means positioned in a position facing a grinding curved surface corresponding to a curvature to be curve chamfered.

These grinding surfaces positioned on opposite sides may have the same curvature or may have different curvatures. When the spacing of the grinding surfaces is formed matching the thickness of the optical filter, it is possible to perform curve chamfering on two edges in one step. Furthermore, when a configuration is used in which the spacing of the grinding surfaces has a width, the thicknesses of the optical filters do not have to be uniform and may be adapted to optical filters of various thicknesses.

Moreover, a storage structure for storing an optical filter according to the present invention is provided with storage case that has a recess portion for storing the optical filter, wherein an inclined surface is formed at an inner periphery surface of the recess portion across a side surface and bottom surface therein, and wherein the optical filter is stored in a state in which a curve chamfered portion of the optical filter is in contact with the inclined surface.

With this storage structure, the optical filter is held in a state in which its curve chamfered portions are in contact with the inclined surface portions of the storage case, and in this case, since curve chamfering has been performed on the optical filter, the edge portions of the optical filter do not make contact in a sharp condition, which allows the occurrence of optical foreign substances to be suppressed.

Further still, an optical device according to the present invention is provided with an image-taking element and a package for accommodating the image-taking element, wherein an opening portion is formed in the package, and wherein an optical filter according to any of the claims 1 to 11 is arranged at the opening portion, covering the opening portion.

With an optical device of the above-described configuration, the opening portion of the package is covered by the optical filter, and this optical filter has the usual function of being a light transmission member and is also provided with a sealing function for the package. This optical filter is curve chamfered on its main surface sides and/or its side surface sides, and therefore, as described above, the optical filter itself does not produce chips, and there are almost no optical foreign substances since the optical filter does not cut the package.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a side view showing an embodiment of an optical filter according to the present invention.

FIG. 2 is an enlarged view of the portion indicated by the arrow RA in FIG. 1.

FIG. 3 is a side view showing another embodiment of an optical filter according to the present invention.

FIG. 4 is a side view showing a further embodiment of an optical filter according to the present invention.

FIG. 5 is a side view showing yet a further embodiment of an optical filter according to the present invention.

FIG. 6 is a side view showing yet a further embodiment of an optical filter according to the present invention.

FIG. 7 is a side view showing yet a further embodiment of an optical filter according to the present invention.

FIG. 8 shows yet a further embodiment of an optical filter according to the present invention, with FIG. 8(a) showing a top view of a main surface and FIG. 8(b) showing a side view thereof.

FIG. 9 shows yet a further embodiment of an optical filter according to the present invention, with FIG. 9(a) showing a top view of a main surface and FIG. 9(b) showing a side view thereof.

FIG. 10 is a top view showing a main-surface side of yet a further embodiment of an optical filter according to the present invention.

FIG. 11 is a top view showing a main-surface side of yet a further embodiment of an optical filter according to the present invention.

FIG. 12 is a side view showing yet a further embodiment of an optical filter according to the present invention.

FIG. 13 is a diagram illustrating an embodiment of a method for manufacturing an optical filter according to the present invention.

FIG. 14 is a diagram illustrating an embodiment of another method for manufacturing an optical filter according to the present invention.

FIG. 15 is a diagram illustrating a grinding device used in a method for manufacturing an optical filter according to the present invention.

FIG. 16 is a diagram for describing another grinding device used in a method for manufacturing an optical filter according to the present invention.

FIG. 17 is a diagram for describing a further grinding device used in a method for manufacturing an optical filter according to the present invention.

FIG. 18 is a cross section of a storage structure for an optical filter according to the present invention.

FIG. 19 is a cross section of a further storage structure for an optical filter according to the present invention.

FIG. 20 is a view of an overall configuration of an image-taking device in which an optical filter according to the present invention is used.

FIG. 21 is a view of an overall configuration of another image-taking device in which an optical filter according to the present invention is used.

BEST MODE FOR CARRYING OUT THE INVENTION

First, an embodiment of an optical filter according to the present invention is described using an optical low pass filter as an example with reference to the accompanying drawings. FIG. 1 is a side view showing an embodiment of an optical filter according to the present invention.

FIG. 2 is an enlarged view of the portion indicated by the arrow RA in FIG. 1.

An optical low pass filter 10 is constituted by a quartz birefringent plate 11, a quarter wavelength plate 12, and a quartz birefringent plate 13 layered in that order. The quartz birefringent plates 11 and 13 use a birefringence effect of quartz to output outgoing beams by separating incident light into ordinary rays and extraordinary rays, and the direction and width of the separated beams can be adjusted as appropriate with predetermined parameters. In this way, an optical low pass filter is constituted by combining quartz birefringent plates and the like as appropriate. The quartz birefringent plate 11 is set, for example, to separate rays in a horizontal direction, and has the function of separating incident light in the horizontal direction using a birefringence effect of quartz. Furthermore, an antireflection coating 14 is formed on the incident light surface (main surface) of the quartz birefringent plate 14. Although not shown in detail in the drawings, the antireflection coating 14 is formed by multilayering dielectric thin films made of metal oxide films or the like. On the other hand, the quartz birefringent plate 13 is set, for example, to separate rays at a 90 degree angle, and has the function of splitting incident light in a 90 degree direction using a birefringence effect of quartz. Furthermore, an infrared cut coating 15 is formed on the outgoing light surface (main surface) of the quartz birefringent plate 13. Although not shown in detail in the drawings, the infrared cut coating 15 is also formed by multilayering dielectric thin films.

Curved chamfered portions 13 a and 13 b are formed at the periphery of the outgoing light surface (main surface) of the quartz birefringent plate 13. As shown in FIGS. 1 and 2, the curved chamfering is a formation in which edge portions are chamfered to a curved condition, and the chamfering of the main surface-side edge is configured with a predetermined curvature so that the amount of chamfering on the main surface-side edge is less than the amount of chamfering on the side surface-side edge. That is, the chamfering width t2 on the main surface-side shown in FIG. 2 is made shorter than the chamfering width t1 on the side surface side. With such a configuration, since edges are not formed as compared with conventional straight chamfering, the occurrence of optical foreign substances caused by cracking or chipping of the optical filter can be reduced, and it is also possible to greatly inhibit the occurrence of optical foreign substances caused by edge portions cutting into the packaging case or the like. Moreover, by reducing the width of chamfering on the main surface side, the area of actual optical information transmission on the main surface can be kept broad, thus reducing the loss of optical information. The present invention can suppress image deterioration particularly with regard to recent rapid advances in miniaturization of image-taking devices such as video cameras.

The above embodiment described a configuration in which only one main surface was curve chamfered, but an optical low pass filter 30, as shown in FIG. 3, in which both main surfaces are curve chamfered is also possible. The optical low pass filter 30 is constituted by a birefringent plate 31, an infrared cut filter 32, a phase difference plate 33, and a birefringent plate 34 layered in that order, with curve chamfering performed on the birefringent plates 31 and 34, which are positioned as the two main surfaces of the optical low pass filter 30, thus forming curve chamfered portions 31 a, 31 b, 34 a, and 34 b.

Furthermore, the optical low pass filters 40 and 50 shown in FIGS. 4 and 5 are each constituted by a single optical plate 41 and 51. The optical low pass filter 40 is configured with curve chamfered portions 41 a and 42 b formed on one main surface side, and the optical low pass filter 50 is configured with curve chamfered portions 51 a, 51 b, 51 c, and 51 d formed on both main surface sides.

Moreover, as shown in FIG. 6, an optical low pass filter 60 is formed with two layered optical plates 61 and 62, and may have curve chamfered portions 61 a, 61 b, 62 a, and 62 b formed on both main surface sides.

Also, as shown in FIG. 7, an optical low pass filter 70 is formed with three layered optical plates 71, 72, and 73, and may have curve chamfered portions 71 a to 71 d, 72 a to 72 d, and 73 a to 73 d formed on both main surface sides of each of the optical plates 71, 72, and 73.

And moreover, similar to FIGS. 4 and 5, an optical low pass filter 80 as shown in FIG. 8 is made of a single optical plate 81. Curve chamfering is performed on the side surface sides, forming curve chamfered portions 81 a to 81 d. And very finely chamfered portions 82 a are formed on the main surface side.

As a configuration in which curve chamfering is performed on the side surface sides, there is also a configuration in which curve chamfering is also performed on the main surface side, as shown in FIG. 9. An optical low pass filter 90 is made of a single optical plate 91, with curve chamfered portions 91 a to 91 d on the side surface sides and curve chamfered portions 91 e to 91 h on the main surface side, so that the optical low pass filter 90 has no edges on any surface, and is thus a configuration which has the least contact-related damage.

It should be noted that, although not shown in the drawings, optical filters made of one or a plurality of optical plates according to the present invention may also be configured so that curve chamfering is performed on a side surface and one main surface side.

Any of the optical filters according to the present invention may be provided as required with an infrared cut coating or an antireflection coating or the like on the main surface of the optical plate.

The optical filters according to the present invention have been created focusing on the perspective of the shape of the optical filter, such that any impact at the time of contact is reduced in order to inhibit the occurrence of optical foreign substances, but since the nature of the surface itself can be thought of as a cause of optical foreign substances that must be overcome in order to further inhibit the occurrence of optical foreign substances, it is preferable to apply the present invention after making considerations as appropriate to the nature of the surface.

Furthermore, as shown in the configurations of the optical filters shown in FIGS. 1 through 11, it is preferable that flat areas are formed on the side surfaces or that flat areas are left there when curve chamfering is performed. The basis for this is explained using a comparison with the case of all side surfaces being formed as round shapes. First, a micrometer or the like is used when measuring the outer dimensions, and such dimensional measurements become difficult when all the side surfaces are formed as round shapes, and thus there is the advantage of ease of measurement when flat areas are formed on the side surfaces. Moreover, when all side surfaces are formed as round shapes, it is necessary to prepare diamond wheels with different radial dimensions for the diamond wheels used in curve chamfering processes and grinding processes in accordance with the thickness of the workpiece (optical plate). In contrast to this, even when there are differences in the thicknesses of the workpiece (optical plate), it is possible to use the same single diamond wheel of a radial dimension that can be used for all the flat areas, thus increasing the range over which tools can used in manufacturing.

Furthermore, it is possible to clearly indicate the separation direction of incident light on the birefringent plate by varying the widths of curve chamfering.

For example, with an optical filter 100 shown in FIG. 10, it is possible to clearly indicate the direction of light separation by making the curve chamfered portions 104 and 105, which are curve chamfered edges of opposing sides, larger than the curve chamfered portion 103 (t4=t5, t4>t3). Moreover, with an optical filter 110 shown in FIG. 11, it is possible to clearly indicate the direction of light separation by making the curve chamfered portion 114, which is a wide curve chamfered edge of one side, larger than the curve chamfered portion 113 (t6<t8<t7).

As a configuration in which the width of curve chamfering is varied, an optical filter 120 as shown in FIG. 12 is possible in which the amount of curve chamfering on the edges of one main surface side is smaller than the amount of curve chamfering on the edges of the other main surface side. In the present embodiment, curve chamfering is performed respectively on the four edges of each main surface. The following is a description of the present embodiment based on the accompanying drawings.

With the optical filter 120, curve chamfered portions 121 a and 121 b of the edges of a main surface 121A of the optical plate 121 are chamfered to have an equivalent curvature. On the other hand, curve chamfered portions 121 c and 121 d of the edges of a main surface 121B are chamfered to have an equivalent curvature and so as to have a different curvature from the curve chamfered portions 121 a and 121 b of the edges of the main surface 121A. In this embodiment, the chamfering width s2 of the edges of the main surface 121A is smaller than the chamfering width s1 of the edges of the main surface 121B (s2<s1).

With the optical filter 120 it is possible to identify the front and back of the optical filter 120, not only visually, but also by the sense of touch. It is also possible to carry out this identification using a screen recognition device. In a coating process that will be discussed later below, it is necessary to apply a coating to only one main surface on one side, and in this case it is extremely important to be able to perform front and back identification accurately and with ease. And because such identification is particularly difficult when the optical filters are thin, by using different amounts of chamfering for one main surface and the other main surface as in the present configuration, that is, by making the curvature of the curve chamfering performed on each main surface different, it is easy to identify the front and back of the optical filter.

The following is a description of a method for manufacturing an optical filter according to the present invention.

As mentioned earlier, the multi-cutout manufacturing method has often been used in recent years from the point of view of reducing manufacturing costs. FIG. 13 shows an embodiment in which a method for manufacturing an optical filter according to the present invention has been applied in a multi-cutout manufacturing method.

In the multi-cutout manufacturing method, at the stage before the wafer is cut into small pieces, the necessary structural members are laminated according to the required wave-filtering characteristics. That is, an optical filter wafer 8 can be obtained, for example, by bonding in order a quarter wavelength plate wafer 8 b and a birefringent plate wafer 8 c, which separates light perpendicularly, on a birefringent plate wafer 8 a, which separates light horizontally.

Next, the optical filter wafer 8 is cut into predetermined small pieces by a blade 120 while, for example, the wafer is temporarily fixed on a support stand 9 by an adhesive. The blade 120 used in this cutting into small pieces is a disk-shaped dicing blade. As shown in FIG. 13, viewed in cross section, the blade 120 has a small width and is provided with a chamfering blade portion 122 that has a parallel cutting portion 121, the planar shape of which is circular, and a curved surface portion 122 a, which is formed at an inner portion of the circular shape. The curved surface portion 122 a is formed with a curved surface in accordance to the curvature required to chamfer the edge portions of the optical filter to a predetermined curvature. Slicing (arrow Y1) is performed to a depth proximal to the tip portion of the curved surface portion 122 a while rotating (arrow R1) the blade 120 at high speed to cut the optical filter wafer 8 into a matrix shape. In this way, the cut surfaces of the wafer become the side surfaces of the optical filter 10, and a curve chamfered portion 13 a is formed on one main surface side of the optical filter 10. After this, the adhesive is dissolved, and the individual optical filters 10 are separated. It should be noted that the shape of curve chamfering can be controlled using the shape of the curved surface portion 122 a of the blade 120.

Furthermore, as shown in FIG. 2 for example, in regard to the chamfering of the edges of the main surface, when the chamfering width of the main surface side is smaller than the chamfering width of the side surface side, the radial length of the blade 120 becomes relatively longer due to the shape of the curved portion 122 a, and the curved portion 122 a as a whole is a sharp shape along the parallel cutting portion 121.

FIG. 14 is a diagram for describing another embodiment of a method for manufacturing an optical filter according to the present invention.

A step cutting method is employed in this embodiment using two types of blades as shown in FIG. 14.

First, as in the previous embodiment, at the stage before the wafer is cut into small pieces, the necessary structural members are laminated according to the required wave-filtering characteristics. That is, the optical filter wafer 8 can be obtained by bonding in order the quarter wavelength plate wafer 8 b and the birefringent plate wafer 8 c, which separates light perpendicularly, on the birefringent plate wafer 8 a, which separates light horizontally.

Next, the optical filter wafer 8 is cut into predetermined small pieces by a flat blade 132 while the wafer is adhered to the support stand 9 by an adhesive. The blade used in this cutting into small pieces is a disk-shaped dicing blade and, as shown in FIG. 14, when viewed in cross section, the blade is made of only a fine-width parallel cutting portion. The edge portions of the optical filter 10 are chamfered to a predetermined curvature with a chamfering blade 131. The chamfering blade 131 used in this process is formed with a curvature corresponding to the applicable curvature. After this, the adhesive is dissolved, and the individual optical filters 10 are separated from the support stand 9. Curve chamfering is performed after cutting into small pieces in this manufacturing method, but it is also possible to first perform curve chamfering using the chamfering blade 131 and then to perform cutting into small pieces using the flat blade 132 after that.

Furthermore, it is also possible to set in advance the spacing between these blades and perform parallel cutting with a predetermined spacing after adjusting the blades to the required height (slicing depth adjustment).

Moreover, it is also possible to perform cutting by a multi-blade configuration with the same type of blades positioned in parallel.

The present embodiment was described using a case in which curve chamfering was performed on only one surface of the optical filter, but when manufacturing optical filters such as those shown in FIGS. 3, 5, 6, 7, and 9, or when manufacturing optical filters of a configuration in which chamfered portions are formed on both main surfaces of the optical plate, a method can be executed in which curve chamfering is performed on one main surface by cutting a portion of the optical filter wafer 8 with the chamfering blade 131 used in the manufacturing method shown in FIG. 14 for example, then turning the optical filter wafer 8 over and adhesively fixing it and performing curve chamfering again by cutting with the blade 120 used in FIG. 13 after making the required positional adjustments.

In the above-described manufacturing method, it is also possible to use a grinding tool 5 as shown in FIG. 15 when performing curve chamfering on the edges of the optical filter. The grinding tool 5 is formed so that the cross section of the diamond wheel for performing curve chamfering on the edges of the optical filter 1 has a U-shaped grooved surface, and is configured so that opposite curved surfaces 5 a and 5 b are ground to a predetermined curvature. The grinding tool 5 is provided with a grinding surface that has the same curvature.

Grinding is carried in this grinding process by bringing the curved surface 5 a or 5 b of the grinding tool into contact with a predetermined surface of the optical filter 1. It is possible to move the optical filter 1 in the direction of the arrow X1, and the thickness of the optical filter 1 can be adapted to various widths within the distance in which movement is possible, which offers better usability since a width b can be applied to the thickness of the optical filter 1 to be curve chamfered.

Furthermore, when it is desired to vary the curve of opposite curved surfaces, it is possible to use a grinding tool 6 that has curved surfaces 6 a and 6 b with different curvatures as shown in FIG. 16. Also in this case, the grinding can be performed with the same method as in FIG. 15.

Furthermore, when not curve chamfering in order on each edge by moving the optical filter as shown in FIG. 15 or FIG. 16, but instead performing curve chamfering simultaneously on the edges of both main surfaces, it is possible to use a grinding tool 7 as shown in FIG. 17 for example. As in FIGS. 15 and 16, this grinding tool 7 is formed with a diamond wheel forming a grooved surface, the cross section of which is U-shaped. The width into which the optical filter to be curve chamfered can be fit into the grinding tool 7 is the point of difference between the grinding tool 7 and the grinding tools 5 and 6. The U-shaped curved grinding surface is moved in the direction of the arrow Y2 so that the optical filter 1 is fit into it and curve chamfering is performed. Curve chamfering of both main surfaces can be performed simultaneously when using the grinding tool 7, which makes this tool superior in terms of operational efficiency.

After an optical filter has been cut into small pieces and undergone peripheral processing (curve chamfering) of the methods shown in FIGS. 13 through 17, the portions of the side surfaces of the optical filter that have been made rough are smoothened by wet etching after rinsing. The etching solution used in this process is a mixed solution of ammonium fluoride, hydrofluoric acid, and the like. Rinsing is performed after this process, then the thicknesses of the main surfaces are adjusted to a predetermined thickness with a secondary grinding process. After further rinsing, the main surfaces of the optical filter are given a mirror finish using a polishing-grinding process. Then, after further rinsing, the main surface that is to become the optical surface is given a coating film. When the main surface sides of the optical filter are given different curvatures with curve chamfering as shown in FIG. 12 for example, it is easy to identify the main surface for coating in this process, which is another advantage of a configuration in which the chamfering for the curves are varied.

The following is a description of a configuration for storing an optical filter according to the present invention manufactured by the above-described manufacturing method.

Since the optical filter is stored in a case in a condition in which the surface for incoming optical information is exposed, it is necessary to thoroughly eliminate optical foreign substances. FIG. 18 is a cross section of a storage structure in which optical filters 15 and 16 are stored in a storage case 17.

The storage case 17 has storage recess portions 171 and 174 for storing the optical filters 15 and 16. Inclined surface portions 172 and 173 (175 and 176) are incorporated continuously in the base portion periphery of each storage recess portion 171 (174). The curve chamfered portions 151 and 152 (161 and 162) formed respectively on one main surface side of the optical filter 15 (16) are brought into contact respectively with the inclined surface portions 172 and 173 (175 and 176) and are horizontally mounted and stored in the storage case 17 in this state. With this storage structure, storage is achieved without any acute angle contact between the curve chamfered portions 151 and 152 (161 and 162) of the optical filter 15 (16) and the inclined surface portions 172 and 173 (175 and 176) of the storage case 17, thus enabling the suppression of optical foreign substances caused by contact with the storage case 17.

This storage structure is an embodiment in which the optical filters are laid flat with their main surface facing up, but the following is a description of yet another embodiment in which the optical filter is stood on its side surface portions as shown in FIG. 19.

As in the above-described embodiment, a storage recess portion 210 is formed in this storage structure for storing the optical filter 15 in a storage case 20. Inclined surface portions 201 and 202 are formed in the base portion periphery of the storage recess portion 210. The optical filter 15, the side surface edges of which are chamfered to form curve chamfered portions 153, 154, 155, and 155, is stood on its side surface portions for storage in the storage recess portion 210. That is, the curve chamfered portions 153 and 154 are respectively held by being brought into contact with the inclined surface portions 201 and 202 of the storage case 20. With this storage structure too, storage is achieved without any acute angle contact between the curve chamfered portions 153 and 154 of the optical filter 15 and the inclined surface portions 201 and 202 of the storage case 20, thus enabling the suppression of optical foreign substances caused by contact with the storage case 20.

Moreover, a press-down plate 25 may be latched and fixed to the storage case 20 to stably hold the optical filter 15. A pressing portion 25 a is provided at the press-down plate 25 and presses an upper side surface 15 a of the optical filter 15 while the filter is fixed. The pressing portion 25 a is formed as a curved surface and is made of a material that has cushioning properties. Accordingly, when the press-down plate 25 is fixed to the storage case 20, the pressing portion 25 a causes no damage to the optical filter 15.

In the above-described storage structure, it is also possible that the structure of the inclined surface portions of the storage case do not have a constant inclined surface, but rather have a concave curvature or a convex curvature for example.

It should be noted that the present embodiment was described for a storage case having two storage recess portion holes, but it is also possible to use a storage case in which a multitude of storage recess portions are formed in a matrix shape, and it is also possible to use a configuration in which multiple tiers of such storage cases are stacked.

When used in an image-taking device, since the optical filter according to the present invention has no edges after undergoing curve chamfering as described above, chips or other debris of the optical filter are not produced, and therefore there are almost no optical foreign substances produced from the optical filter itself. Furthermore, this enables the occurrence of optical foreign substances due to cutting of the CCD package by the optical filter to be suppressed. FIGS. 20 and 21 are views of overall configurations of examples of image-taking devices in which optical filters according to the present invention are used.

An image-taking device 180 shown in FIG. 20 is provided with a CCD package 185 made of ceramic, and a CCD 182 is mounted in the recess portion provided in the CCD package 185 so that the opening portion of the recess portion is covered by an optical filter 181. The optical filter 181 is mounted on a step 183 provided on the inside surface of the recess portion. The optical filter 181 is configured such that both main surface sides and side surface sides have undergone curve chamfering. Accordingly, as described above, the optical filter 181 is prevented from producing chips or other debris, and since there is no cutting of the CCD package 185 by the optical filter 181, there are almost no optical foreign substances produced. Moreover, since the opening portion of the recess portion is covered by the optical filter 181, this also performs the role of providing the CCD package 185 with sealing properties.

Furthermore, the configuration of a CCD package 195 of an image-taking device 190 shown in FIG. 21 is different from the configuration shown in FIG. 20. The CCD package 195 is formed with members 95 a forming a side wall attached to a member 95 b, which forms a base portion. Upper portions of the members 95 a are formed with protruding portions 951 that protrude inward so as to enclose the opening portion of the CCD package 195. The optical filter 181 is fixed with an adhesive to the inner sides of the protruding portions 951 as well as to side surfaces 952 of the members 95 a, and this also performs the role of providing the CCD package 185 with sealing properties.

INDUSTRIAL APPLICABILITY

As described above, due to the continued miniaturization of image-taking devices such as video cameras, the distance between the CCD and the optical filter has been becoming shorter in recent years, so that the adherence of optical foreign substances to the optical filter has become an even worse image defect. An optical filter according to the present invention is superior in that it solves this issue and is beneficial as a structure that thoroughly eliminates the occurrence of optical foreign substances. The method by which optical filters of this structure can be manufactured is also beneficial and, from the perspective of being able to maintain the quality of such a high quality optical filter, a structure can be provided for storing a thus-manufactured optical filter. 

1. An optical filter comprising one or a plurality of optical plates, wherein curve chamfering is performed on an edge of at least a side surface side of the optical filter.
 2. An optical filter comprising one or a plurality of optical plates, wherein curve chamfering is performed on an edge of one main surface side of the optical filter.
 3. An optical filter comprising one or a plurality of optical plates, wherein curve chamfering is performed on edges of both main surface sides of the optical filter.
 4. An optical filter according to claim 1, wherein the curve chamfering is performed on one main surface side.
 5. An optical filter according to claim 1, wherein the curve chamfering is performed on both main surface sides.
 6. An optical filter comprising a plurality of optical plates, wherein curve chamfering is performed on an edge of at least a side surface side of those optical plates.
 7. An optical filter comprising a plurality of optical plates, wherein curve chamfering is performed on an edge of one main surface side of those optical plates.
 8. An optical filter comprising a plurality of optical plates, wherein curve chamfering is performed on an edge of both main surface sides of those optical plates.
 9. An optical filter according to claim 6, wherein the curve chamfering is performed on one main surface side.
 10. An optical filter according to claim 6, wherein the curve chamfering is performed on both main surface sides.
 11. An optical filter according to claim 2, wherein, in the curve chamfering of the edges of the main surface side, an amount of chamfering on a main surface side is smaller than an amount of chamfering on a side surface side.
 12. An optical filter according to claim 2, wherein, in the curve chamfering of the edges of the main surface side, an amount of chamfering on one main surface side is smaller than an amount of chamfering on another main surface side.
 13. A method for manufacturing an optical filter according to claim 2, comprising a step of cutting an optical wafer, which has been formed as a single optical wafer or a plurality of layered optical wafers that can be cut into a plurality of optical plates, into small pieces using a dicing blade so that divided surfaces of the optical wafer are parallel, and a step of curve chamfering the optical wafer using a curved surface blade having a curved surface whose curvature corresponds to a position of an edge to be curve chamfered.
 14. A method for manufacturing an optical filter according to claim 2, wherein after an optical wafer that can be cut into a plurality of optical plates is formed as a single optical wafer or a plurality of layered optical wafers, a blade is used that is provided with a dicing blade portion with which divided surfaces of the optical wafer become parallel to one another, and a curved surface blade portion that has a curvature corresponding to a curvature of an edge to be curve chamfered, and the optical wafer is cut into small pieces with the dicing blade portion, after which curve chamfering is performed with the curved surface blade portion on an edge of the optical wafer that has been cut into small pieces.
 15. A method for manufacturing an optical filter according to claim 1, wherein after an optical wafer that can be cut into a plurality of optical plates is formed by layering at least one optical wafer, the optical wafer is cut into small pieces using a dicing blade so that divided surfaces of the optical wafer are parallel, and an edge of the optical wafer that has been cut into small pieces is curve chamfered by grinding with a grinding means positioned in a position facing a grinding curved surface corresponding to a curvature to be curve chamfered.
 16. A storage structure for storing an optical filter according to claim 1, comprising a storage case that has a recess portion for storing the optical filter, wherein an inclined surface is formed at an inner periphery surface of the recess portion across a side surface and bottom surface therein, and wherein the optical filter is stored in a state in which a curve chamfered portion of the optical filter is in contact with the inclined surface.
 17. An optical device comprising an image-taking element and a package for accommodating the image-taking element, wherein an opening portion is formed in the package, and wherein an optical filter according to claim 1 is arranged at the opening portion, covering the opening portion.
 18. An optical filter according to claim 3, wherein, in the curve chamfering of the edges of the main surface side, an amount of chamfering on a main surface side is smaller than an amount of chamfering on a side surface side.
 19. An optical filter according to claim 4, wherein, in the curve chamfering of the edges of the main surface side, an amount of chamfering on a main surface side is smaller than an amount of chamfering on a side surface side.
 20. An optical filter according to claim 7, wherein, in the curve chamfering of the edges of the main surface side, an amount of chamfering on a main surface side is smaller than an amount of chamfering on a side surface side.
 21. An optical filter according to claim 8, wherein, in the curve chamfering of the edges of the main surface side, an amount of chamfering on a main surface side is smaller than an amount of chamfering on a side surface side.
 22. An optical filter according to claim 9, wherein, in the curve chamfering of the edges of the main surface side, an amount of chamfering on a main surface side is smaller than an amount of chamfering on a side surface side.
 23. An optical filter according to claim 3, wherein, in the curve chamfering of the edges of the main surface side, an amount of chamfering on one main surface side is smaller than an amount of chamfering on another main surface side.
 24. An optical filter according to claim 4, wherein, in the curve chamfering of the edges of the main surface side, an amount of chamfering on one main surface side is smaller than an amount of chamfering on another main surface side.
 25. An optical filter according to claim 7, wherein, in the curve chamfering of the edges of the main surface side, an amount of chamfering on one main surface side is smaller than an amount of chamfering on another main surface side.
 26. An optical filter according to claim 8, wherein, in the curve chamfering of the edges of the main surface side, an amount of chamfering on one main surface side is smaller than an amount of chamfering on another main surface side.
 27. An optical filter according to claim 9, wherein, in the curve chamfering of the edges of the main surface side, an amount of chamfering on one main surface side is smaller than an amount of chamfering on another main surface side.
 28. A method for manufacturing an optical filter according to claim 3, comprising a step of cutting an optical wafer, which has been formed as a single optical wafer or a plurality of layered optical wafers that can be cut into a plurality of optical plates, into small pieces using a dicing blade so that divided surfaces of the optical wafer are parallel, and a step of curve chamfering the optical wafer using a curved surface blade having a curved surface whose curvature corresponds to a position of an edge to be curve chamfered.
 29. A method for manufacturing an optical filter according to claim 4, comprising a step of cutting an optical wafer, which has been formed as a single optical wafer or a plurality of layered optical wafers that can be cut into a plurality of optical plates, into small pieces using a dicing blade so that divided surfaces of the optical wafer are parallel, and a step of curve chamfering the optical wafer using a curved surface blade having a curved surface whose curvature corresponds to a position of an edge to be curve chamfered.
 30. A method for manufacturing an optical filter according to claim 7, comprising a step of cutting an optical wafer, which has been formed as a single optical wafer or a plurality of layered optical wafers that can be cut into a plurality of optical plates, into small pieces using a dicing blade so that divided surfaces of the optical wafer are parallel, and a step of curve chamfering the optical wafer using a curved surface blade having a curved surface whose curvature corresponds to a position of an edge to be curve chamfered.
 31. A method for manufacturing an optical filter according to claim 8, comprising a step of cutting an optical wafer, which has been formed as a single optical wafer or a plurality of layered optical wafers that can be cut into a plurality of optical plates, into small pieces using a dicing blade so that divided surfaces of the optical wafer are parallel, and a step of curve chamfering the optical wafer using a curved surface blade having a curved surface whose curvature corresponds to a position of an edge to be curve chamfered.
 32. A method for manufacturing an optical filter according to claim 9, comprising a step of cutting an optical wafer, which has been formed as a single optical wafer or a plurality of layered optical wafers that can be cut into a plurality of optical plates, into small pieces using a dicing blade so that divided surfaces of the optical wafer are parallel, and a step of curve chamfering the optical wafer using a curved surface blade having a curved surface whose curvature corresponds to a position of an edge to be curve chamfered.
 33. A method for manufacturing an optical filter according to claim 3, wherein after an optical wafer that can be cut into a plurality of optical plates is formed as a single optical wafer or a plurality of layered optical wafers, a blade is used that is provided with a dicing blade portion with which divided surfaces of the optical wafer become parallel to one another, and a curved surface blade portion that has a curvature corresponding to a curvature of an edge to be curve chamfered, and the optical wafer is cut into small pieces with the dicing blade portion, after which curve chamfering is performed with the curved surface blade portion on an edge of the optical wafer that has been cut into small pieces.
 34. A method for manufacturing an optical filter according to claim 4, wherein after an optical wafer that can be cut into a plurality of optical plates is formed as a single optical wafer or a plurality of layered optical wafers, a blade is used that is provided with a dicing blade portion with which divided surfaces of the optical wafer become parallel to one another, and a curved surface blade portion that has a curvature corresponding to a curvature of an edge to be curve chamfered, and the optical wafer is cut into small pieces with the dicing blade portion, after which curve chamfering is performed with the curved surface blade portion on an edge of the optical wafer that has been cut into small pieces.
 35. A method for manufacturing an optical filter according to claim 7, wherein after an optical wafer that can be cut into a plurality of optical plates is formed as a single optical wafer or a plurality of layered optical wafers, a blade is used that is provided with a dicing blade portion with which divided surfaces of the optical wafer become parallel to one another, and a curved surface blade portion that has a curvature corresponding to a curvature of an edge to be curve chamfered, and the optical wafer is cut into small pieces with the dicing blade portion, after which curve chamfering is performed with the curved surface blade portion on an edge of the optical wafer that has been cut into small pieces.
 36. A method for manufacturing an optical filter according to claim 8, wherein after an optical wafer that can be cut into a plurality of optical plates is formed as a single optical wafer or a plurality of layered optical wafers, a blade is used that is provided with a dicing blade portion with which divided surfaces of the optical wafer become parallel to one another, and a curved surface blade portion that has a curvature corresponding to a curvature of an edge to be curve chamfered, and the optical wafer is cut into small pieces with the dicing blade portion, after which curve chamfering is performed with the curved surface blade portion on an edge of the optical wafer that has been cut into small pieces.
 37. A method for manufacturing an optical filter according to claim 9, wherein after an optical wafer that can be cut into a plurality of optical plates is formed as a single optical wafer or a plurality of layered optical wafers, a blade is used that is provided with a dicing blade portion with which divided surfaces of the optical wafer become parallel to one another, and a curved surface blade portion that has a curvature corresponding to a curvature of an edge to be curve chamfered, and the optical wafer is cut into small pieces with the dicing blade portion, after which curve chamfering is performed with the curved surface blade portion on an edge of the optical wafer that has been cut into small pieces.
 38. A method for manufacturing an optical filter according to claim 2, wherein after an optical wafer that can be cut into a plurality of optical plates is formed by layering at least one optical wafer, the optical wafer is cut into small pieces using a dicing blade so that divided surfaces of the optical wafer are parallel, and an edge of the optical wafer that has been cut into small pieces is curve chamfered by grinding with a grinding means positioned in a position facing a grinding curved surface corresponding to a curvature to be curve chamfered.
 39. A method for manufacturing an optical filter according to claim 3, wherein after an optical wafer that can be cut into a plurality of optical plates is formed by layering at least one optical wafer, the optical wafer is cut into small pieces using a dicing blade so that divided surfaces of the optical wafer are parallel, and an edge of the optical wafer that has been cut into small pieces is curve chamfered by grinding with a grinding means positioned in a position facing a grinding curved surface corresponding to a curvature to be curve chamfered.
 40. A method for manufacturing an optical filter according to claim 6, wherein after an optical wafer that can be cut into a plurality of optical plates is formed by layering at least one optical wafer, the optical wafer is cut into small pieces using a dicing blade so that divided surfaces of the optical wafer are parallel, and an edge of the optical wafer that has been cut into small pieces is curve chamfered by grinding with a grinding means positioned in a position facing a grinding curved surface corresponding to a curvature to be curve chamfered.
 41. A method for manufacturing an optical filter according to claim 7, wherein after an optical wafer that can be cut into a plurality of optical plates is formed by layering at least one optical wafer, the optical wafer is cut into small pieces using a dicing blade so that divided surfaces of the optical wafer are parallel, and an edge of the optical wafer that has been cut into small pieces is curve chamfered by grinding with a grinding means positioned in a position facing a grinding curved surface corresponding to a curvature to be curve chamfered.
 42. A method for manufacturing an optical filter according to claim 8, wherein after an optical wafer that can be cut into a plurality of optical plates is formed by layering at least one optical wafer, the optical wafer is cut into small pieces using a dicing blade so that divided surfaces of the optical wafer are parallel, and an edge of the optical wafer that has been cut into small pieces is curve chamfered by grinding with a grinding means positioned in a position facing a grinding curved surface corresponding to a curvature to be curve chamfered.
 43. A storage structure for storing an optical filter according to claim 2, comprising a storage case that has a recess portion for storing the optical filter, wherein an inclined surface is formed at an inner periphery surface of the recess portion across a side surface and bottom surface therein, and wherein the optical filter is stored in a state in which a curve chamfered portion of the optical filter is in contact with the inclined surface.
 44. A storage structure for storing an optical filter according to claim 3, comprising a storage case that has a recess portion for storing the optical filter, wherein an inclined surface is formed at an inner periphery surface of the recess portion across a side surface and bottom surface therein, and wherein the optical filter is stored in a state in which a curve chamfered portion of the optical filter is in contact with the inclined surface.
 45. A storage structure for storing an optical filter according to claim 6, comprising a storage case that has a recess portion for storing the optical filter, wherein an inclined surface is formed at an inner periphery surface of the recess portion across a side surface and bottom surface therein, and wherein the optical filter is stored in a state in which a curve chamfered portion of the optical filter is in contact with the inclined surface.
 46. A storage structure for storing an optical filter according to claim 7, comprising a storage case that has a recess portion for storing the optical filter, wherein an inclined surface is formed at an inner periphery surface of the recess portion across a side surface and bottom surface therein, and wherein the optical filter is stored in a state in which a curve chamfered portion of the optical filter is in contact with the inclined surface.
 47. A storage structure for storing an optical filter according to claim 8, comprising a storage case that has a recess portion for storing the optical filter, wherein an inclined surface is formed at an inner periphery surface of the recess portion across a side surface and bottom surface therein, and wherein the optical filter is stored in a state in which a curve chamfered portion of the optical filter is in contact with the inclined surface.
 48. An optical device comprising an image-taking element and a package for accommodating the image-taking element, wherein an opening portion is formed in the package, and wherein an optical filter according to claim 2 is arranged at the opening portion, covering the opening portion.
 49. An optical device comprising an image-taking element and a package for accommodating the image-taking element, wherein an opening portion is formed in the package, and wherein an optical filter according to claim 3 is arranged at the opening portion, covering the opening portion.
 50. An optical device comprising an image-taking element and a package for accommodating the image-taking element, wherein an opening portion is formed in the package, and wherein an optical filter according to claim 6 is arranged at the opening portion, covering the opening portion.
 51. An optical device comprising an image-taking element and a package for accommodating the image-taking element, wherein an opening portion is formed in the package, and wherein an optical filter according to claim 7 is arranged at the opening portion, covering the opening portion.
 52. An optical device comprising an image-taking element and a package for accommodating the image-taking element, wherein an opening portion is formed in the package, and wherein an optical filter according to claim 8 is arranged at the opening portion, covering the opening portion. 